Software & AI Engineering
Singapore
Key Responsibilities
• Communication Architecture: Design, build, and optimize a robust, distributed gRPC microservices architecture to handle high-throughput, low-latency data streaming and control commands across equipment modules.
• Closed-Loop Integration: Architect low-latency messaging pathways that link real-time vision alignment, motion control loops, and AI inference models across the semiconductor equipment.
• Fab & Upstream/Downstream Connectivity: Develop secure, scalable interface standards (SECS/GEM, EDA/Interface A, gRPC) for seamless integration with Fab Host Systems (MES) and line-level advanced process control (APC) software.
• Software System Design: Establish design standards, concurrency models, state machines, and fail-safe safety protocols for complex, continuous-operation equipment software.
• Performance Optimization: Profile and optimize system latency, memory footprint, and network bandwidth across distributed hardware nodes.
• Experience: 6+ years of experience software architecting for complex industrial automation, semiconductor equipment, medical devices, robotics, or high-frequency trading systems.
• Networking & RPC: Recognized expert in gRPC, Protobuf, asynchronous networking, distributed systems, and real-time IPC (Inter-Process Communication) mechanisms.
• Core Languages: Deep mastery of modern C++ (17/20) and Go or Python in Linux/RTOS environments.
• Industrial Protocols: Solid understanding of industrial software standards (SECS/GEM, OPC-UA, EtherCAT) and real-time distributed systems.
Preferred Qualities
• Strong track record of designing software systems from greenfield concepts to high-volume manufacturing (HVM) tool deployments.
• Comfortable working in cross-functional startup environments with hardware, mechatronics, and algorithm engineering teams.